Backplane TFT

ADRC Technology Introduction for ADRC process

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  A total of 40 processes are registered.
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Dry Etch System
Reactive Ion Etching (RIE)

Model. No : AMAT P-5000 (PRECISION 5000)
Company : APPLIED MATERIALS

Substrate size : < 15cm X 15cm
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Wet Etch System
Wet station
 
Metal : Cu, Ti, Mo, Al, IZO, ITO
Insulator : SiO2, SiNx
Semiconductor : a-Si:H, LTPS, IGZO
 
Substrate size : < 15cm X 15cm
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