Bonding Process

ADRC Technology Introduction for ADRC process

Advanced Display Research Center (ADRC) is leading the

world in field of display research.

  A total of 42 processes are registered.
      Enter the process name or specification you want to search and click Search
  • image
FPC Bonding
FPC : Flexible Print Circuit

ACF bonding
Temperature : 110 °C

TAB bonding
Temperature : 280 °C

Bonding procedure : ACF bonding → TAB bonding
  • image
Driver measurement system
Company : Agilent
Model. No. : DSO6052A

500 MHz
Analogue 2ch.
Max. 8 Mpts Deep memory
100,000 wfms/s
Terms  |  Privacy
Advanced Display Research Center (ADRC)
No. 129, Pureunsol Munhwagwan, 26, Kyungheedae-ro, Dongdaemun-gu, Seoul, 02447, Rep. of Korea  |  E-mail : sales@adrc2000.com
Copyright 2017 ⓒ ADRC Co., Ltd. All Rights Reserved. Design by Bizvalley.